Applied Materials, Inc. recently announced a new addition to its Ultima HDP-CVD* product family that targets next-generation gap-fill for advanced STI*, IMD* and PMD* applications. The new Ultima XTMsystem is the first HDP-CVD solution to support sub-100 nm device geometries, enabling the production of future logic, Flash and DRAM devices. "This dramatic advancement to our market-leading Ultima HDP-CVD system is designed to rapidly take customers to their next generation of high-performance devices by meeting sub-100-nanometer technology node requirements," said Dr. Farhad Moghadam, vice president and general manager of Applied Materials' Dielectric Systems and Modules Product Group. "The Ultima X system's capability to extend HDP-CVD for several device generations on a proven platform meets our customers' most aggressive technology needs while lowering their risks and capital investments."
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