Devcon: Pourable Epoxies
September 16, 2002
Devcon's moldmaking compounds are low-viscosity epoxy formulations that mix and pour easily, fill voids completely, reproduce intricate details, and cure with minimal porosity. Aluminum Liquid (F-2) and High-Temp Moldmaker (C-1) are ideal for producing a wide range of molds, dies, patterns, holding fixtures and cast parts. High-Temp Moldmaker (C-1) is a heat-cured epoxy liquid that maintains exceptional compressive strength (to 36,500 psi) at operating temperatures up to 500F. It degasses easily after mixing and is ideal for casting molds or dies to be used in vacuum forming or short-run injection molding. It has a pot life of 90 minutes and achieves functional cure in 24 hours. Aluminum Liquid (F-2) aluminum-filled epoxy has a low viscosity that provides accurate reproduction of mold details on delicate or intricate parts. Cured molds, patterns, or holding fixture can be machined, drilled or tapped and withstand service temperatures up to 250F.
For more information, call (800) 933-8266 or (978) 777-1100, fax (978) 774-0516, or visit http://www.devcon.com .