Master Bond: EP21AO Adhesive with Convenient Mix Ratio Feature
February 16, 2004
Master Bond EP21AO is a two-component, thermally conductive, electrically isolating epoxy adhesive with a 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., this compound is versatile and will adhere well to a variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage and good dimensional stability, and it exhibits superior durability and chemical resistance. EP21AO is an easy-to-apply self-leveling paste. It is 100% reactive and does not contain any solvents or volatiles. It features a thermal conductivity of 10BTU/in/ft2/hr/0F and a dielectric strength of >400 volts/mil.