Altis Selects Silk Resin From Dow
December 4, 2000
Altis Semiconductor will use SiLK® semiconductor dielectric resin from The Dow Chemical Co. in its 0.13-micron device production. Altis will implement a low-k process using SiLK resin to produce 0.13- micron custom logic chips for telecommunications, computer peripherals and wireless applications. Used in combination with high- speed copper interconnects, SiLK resin reportedly enables electrical signals to propagate 37% faster than conventional technologies while using less power.