Master Bond Inc. has introduced a new high-performance, room temperature curing, two-component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft2/hr/0F. Physical properties are maintained even after long exposure to temperatures in the 400-4500F range. EP34AN has superb dimensional stability and a low coefficient of expansion. It also exhibits superior electrical insulation properties.
Our annual R&D Lab Equipment and Instrumentation Directory helps you locate the best suppliers for your needs. This issue also includes articles focused on deformation and tension, materials characterization trends, non-destructive imaging, and more. Check it out!