BCC: Report on CMP Market
January 8, 2004
The chemical mechanical planarization or polishing (CMP) process is vital in semiconductor device production, which uses CMP slurries and pads to planarize the surface of wafers. According to "RGB-288 Chemical Mechanical Polishing Equipment and Materials: A Technical and Market Analysis," a soon-to-be-released report from Business Communications Co., Inc. (BCC), the global market for CMP and post-CMP equipment, CMP slurries, CMP pads, conditioners and other consumables is estimated at $1.7 billion in 2003. This is expected to approach $3.3 billion by 2008, with an average annual growth rate (AAGR) of 14.2% through 2008. The largest share of the market is for CMP and post-CMP equipment, which was $925 million in 2003, constituting 55% of the total CMP market. CMP slurries have a share of 24%, followed by CMP pads with 15% of the market.
For more details or to order the full report, call (203) 853-4266 or visit http://www.bccresearch.com .