Valley Design: Custom Thinning of IC Chips, Dies and Modules
June 17, 2003
Custom thinning services of IC flip chips, smart cards, sensors and modules are now available from Valley Design. As requirements for advanced technologies in the semiconductor industry become more exacting, many applications, including high-speed serial backplanes, optical transceivers, on-card biometric fingerprint sensors and flex circuits, must utilize very thin chips. The benefits of thin chips include improved performance, space savings, increased reliability and reduced package costs. Building on a foundation of 30 years of ultra-thin lapping and polishing expertise, Valley has expanded its capabilities to provide thinning of individual IC chips and modules to exacting tolerances and surface finishes.