Master Bond: Rapid Curing Epoxy Adhesive
June 23, 2003
Master Bond EP51FL is a new two-component, highly flexible epoxy resin system developed by Master Bond Inc. for high-performance bonding. EP51FL has a 1:1 mix ratio, weight or volume. It cures rapidly at room temperature and has a setup time of 30-40 minutes. Cure speeds can be accelerated by the use of heat. It is a 100% reactive system and no solvents or volatiles are emitted during cure. Master Bond EP51FL has excellent bond strength to many different substrates, including metals, glass, ceramics, wood, various rubbers and most plastics. The cured compound exhibits a remarkably high peel strength of more than 25 pli along with an elongation of >125%.