The ADS300(R) precision dicing system from Aii is suitable for dicing thin film disk drive heads, CSP/BGA/MLF and other chip carrier packages, glass for optics and photonics, discrete electronic components, ceramics, steel, ferrite and PZT. The company offers systems for the dicing and grinding market that feature flexible software architecture and include exceptional field service. Controls and software include advanced motion control for utmost performance and flexibility; a simple, comprehensive menu-driven software program using an LCD touch screen; and dedicated DSP for hardware and automation control.
Our annual R&D Lab Equipment and Instrumentation Directory helps you locate the best suppliers for your needs. This issue also includes articles focused on deformation and tension, materials characterization trends, non-destructive imaging, and more. Check it out!