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The new facility will tape cast, via punch and fill ceramic substrates that will be thick film screen printed, laminated and co-fired to produce multi-layer packages for electronic applications. This facility is capable of co-firing both oxide and aluminum nitride substrates and multi-layer packages.
The multi-million dollar facility will greatly expand the production capabilities of the company’s radio frequency (RF) and wireless package products for the Tech-Ceram subsidiary, located in Amesbury, Mass., which is expanding its production capacity by a factor of five. The Tech-Ceram plant is undergoing a 25% expansion program, and personnel at the facility has increased 35%. Ancillary operations, such as quality control and testing, have also expanded their facilities to meet customer expectations. Tech-Ceram is in the final stages of achieving ISO 9002 compliance.