Goodfellow Corp. recently announced the availability of a polyimide film with a chemical structure that provides greater hydrolytic stability (e.g., resistance to steam) and better resistance to alkali solutions than other commercially-available grades of polyimide. These features, in combination with the exceptional properties of polyimide in general, such as high heat resistance, high tensile strength and modulus, radiation resistance, low flammability and smoke emission, low creep, and high wear resistance, offer designers a material with an outstanding range of mechanical and physical properties. Polyimide films are used for capacitors, insulation, printed circuit boards and aerospace applications, among others.
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