FERRO ELECTRONIC MATERIALS: Contact Pastes
Aluminum BSF paste AL 53-140 lowers cell costs by reducing paste lay down by as much as 25%. Its reduced organic content enables high throughput drying and firing, and it maintains low bow with < 180 micron wafers. The paste can improve cell efficiency, offering higher open circuit voltage (Voc) than earlier generation paste, strong BSF over a wide temperature range, and excellent adhesion to silicon.
For additional details, visit www.ferro.com.