Asahi Glass Co. Ltd. (AGC) recently announced it has invested $2.1 million in Triton Microtechnologies Inc., an owner of via-fill technology for interposer substrate, to realize next-generation semiconductor packaging products using ultra-thin glass. By combining its technologies on ultra-thin glass and micro-hole drilling process with Triton Microtechnologies’ via-fill technology, AGC intends to contribute to the acceleration of next-generation semiconductor packaging development using glass.

Next-generation high-density semiconductor packaging is reportedly a promising solution for smaller and higher-function mobile devices; the key to realizing such advanced technology is interposer technologies that interconnect the Si chip and the printed circuit board. AGC has developed carrier glass technology that reportedly enables its customers to handle ultra-thin glass at their sites and micro-hole drilling technology to manufacture ultra-thin glass interposers. The via-fill technology has been needed for the commercialization of ultra-thin glass interposers, and this investment is expected to help AGC put its innovative product into practical use.

For additional information, visit www.agc.com.