Dow Corning Appoints Ang VP of Compound Semiconductor Solutions
Dow Corning recently announced the appointment of Tang Yong (“TY”) Ang to the position of vice president of Compound Semiconductor Solutions, a leading provider of high-quality silicon carbide (SiC) wafer and epitaxy product lines to the global power electronics industry. In his newly created role, TY will lead the company’s expanding Compound Semiconductor Solutions business, and report to the general manager of the Specialty Chemicals business.
“Dow Corning is strongly committed to a leadership role in high-growth SiC technology as it enables a new generation of ever more reliable and efficient power electronic devices,” said Tom Cook, general manager of the Specialty Chemicals business and chief commercial officer for Dow Corning. “TY’s strong record of proven management skills and deep industry expertise make him exceptionally qualified to leverage our Compound Semiconductor Solutions’ strong foundation, and build semiconductor substrate supply capabilities that will support sustainable and unfettered growth of high-quality SiC substrates for our customers’ next-generation power electronics applications.”
For more information, visit www.dowcorning.com.