Altis Semiconductor will use SiLK^® semiconductor dielectric resin from The Dow Chemical Co. in its 0.13-micron device production. Altis will implement a low-k process using SiLK resin to produce 0.13- micron custom logic chips for telecommunications, computer peripherals and wireless applications. Used in combination with high- speed copper interconnects, SiLK resin reportedly enables electrical signals to propagate 37% faster than conventional technologies while using less power.

For additional information, call (800) 441-43689, or visit http://www.altissemiconductor .com or http://www.silk.dow.com.