Aremco-Bond™ 820, a new high-temperature epoxy system, is used for general purpose bonding of ceramics, glass, plastics, metals and other substrates in applications to 400°F. It is a clear, unfilled, 100% solids, 1:1 mix ratio, flexible epoxy system. Flexural and tensile shear strengths are 8000 and 1200 psi, respectively. The volume resistivity is 2.0 x 1014 ohm-cm; dielectric strength is 860 volts per mil; and the dielectric constant is 6.0 at 1.0 kHz. The epoxy system reportedly demonstrates outstanding chemical resistance to acids, alkalis, organic fluids and salts.
For more information, call (914) 268-0039; fax (914) 268-0041, e-mail email@example.com or visit http://www.aremco.com.