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Devcon: Electrically Conductive Adhesive Solders

November 4, 2004
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Syon(R) electrically conductive adhesive solders from Devcon can be used to form conductive paths in applications where hot soldering would be ineffective or impractical. These epoxy and epoxide formulations mix and pour easily, fill voids completely, and cure with minimal air entrapment. They provide exceptional environmental and impact resistance. Syon Tru-Bond(R) 206A conductive adhesive solder is a pourable liquid for bonding electrical components that could be damaged by hot solder. This silver-filled epoxide is also useful where hot solder would not bond to the types of metals or wires to be joined, as well as for microwave shielding.

For more information, call (800) 933-8266 or (978) 777-1100, fax (978) 774-0516, or visit http://www.devcon.com/devconcatsolution.cfm?catid=33.

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