MoreFerro Corp.’s Electronic Material Systems business has advanced its chemical mechanical planarization (CMP) technology with two slurries that enable high-yield processing of 65 and 45 nanometer node electronic devices. CMP is a required process for manufacturing advanced integrated circuits. Ferro’s new CMP slurries precisely plane silicon wafers to a uniform surface, enabling the stacking of multifunctional layers that support smaller, faster and more energy-efficient microprocessors; memory chips with greater storage capacity; and lighter devices for mobile applications. “Our customers have demanded increased performance to meet the needs of the new device generations, and our R&D team responded aggressively,” said Barry Russell, vice president, Ferro Electronic Material Systems. “Building on our more than 30 years of expertise in ceria particle engineering, and by working closely with our customers, we have made the technology breakthroughs that were required.”
Additional information is available at www.ferro.com.
Additional information is available at www.ferro.com.
With access to over one million professionals and more than 60 industry-specific publications,
