Two new contact pastes can improve solar cell efficiency and throughput rates, enabling solar energy to become a more cost-competitive energy generation alternative. Both pastes are RoHS-compliant and lead- and phthalate-free. NS 33-512 front contact paste increases electrical efficiency by up to 0.6% and enables fast printing of three bus bar cell designs. It is designed for silicon wafers with 70 ohm/sq emitters, which represents a significant portion of the industry.
Aluminum BSF paste AL 53-140 lowers cell costs by reducing paste lay down by as much as 25%. Its reduced organic content enables high throughput drying and firing, and it maintains low bow with < 180 micron wafers. The paste can improve cell efficiency, offering higher open circuit voltage (Voc) than earlier generation paste, strong BSF over a wide temperature range, and excellent adhesion to silicon.
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