IBM recently announced the largest capital investment in its history, including plans to build the world's most technologically advanced chip-making facility in East Fishkill, N.Y. The new facility will combine - for the first time anywhere - IBM chip-making breakthroughs such as copper interconnects, silicon-on-insulator (SOI) and low-k dielectric insulation on 300mm (12-in.) wafers. IBM also expects to be the first chip-maker to mass produce semiconductors at line-widths below 0.10 microns, more than 1000 times thinner than a human hair. The new facility is planned to begin operation in the second half of 2002, bringing up to 1000 new jobs to the region upon full production in early 2003. The $2.5 billion plant is part of a total $5 billion capital investment plan to support IBM's growing semiconductor business around the world. In addition to the New York facility, the company is expanding chip-making capacity in its existing Burlington, Vt., and Yasu, Japan, facilities, as well as in Altis Semiconductor, a joint venture between IBM and Infineon located in Corbeil-Essonnes, France. IBM is also expanding organic and ceramic chip packaging operations worldwide.

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