MoreIndium Corp. recently announced that it has acquired the processes, equipment and know-how of Reactive NanoTechnologies, Inc. (RNT), developer and manufacturer of NanoFoil®. Indium will move the RNT process and equipment, as well as a core staff, into its Utica Business Park facility in Utica, N.Y.
Minimal disruption will occur in the RNT business operation, as integration activities have already been underway. Customers will now place their orders and inquires directly through Indium. The core RNT team, along with Indium personnel, will continue to support the NanoFoil and NanoBond® business.
“We are very excited about this acquisition by Indium Corporation,” said Joe Grzyb, RNT's CEO. “Indium’s presence in the global electronics materials market will allow NanoBond technology to proliferate more quickly and broadly. There is a strong synergy with the Indium Corporation solder, assembly and thermal interface materials product lines.”
According to Ross Berntson, Indium’s vice president of Sales, Marketing, and Technical Support, “Indium Corporation is pleased to add another advanced joining technology to our portfolio. We expect this nano-technology to enhance Indium Corporation’s diversity and strength as a materials supplier to the $2.8 billion sputtering target market, as well as to enhance our position in the metallic thermal interface market, two application segments that are the primary focus of this business. Additionally, we are pleased to bring this technology and business to the city of Utica.”
For more information, visit www.indium.com or www.rntfoil.com.
Minimal disruption will occur in the RNT business operation, as integration activities have already been underway. Customers will now place their orders and inquires directly through Indium. The core RNT team, along with Indium personnel, will continue to support the NanoFoil and NanoBond® business.
“We are very excited about this acquisition by Indium Corporation,” said Joe Grzyb, RNT's CEO. “Indium’s presence in the global electronics materials market will allow NanoBond technology to proliferate more quickly and broadly. There is a strong synergy with the Indium Corporation solder, assembly and thermal interface materials product lines.”
According to Ross Berntson, Indium’s vice president of Sales, Marketing, and Technical Support, “Indium Corporation is pleased to add another advanced joining technology to our portfolio. We expect this nano-technology to enhance Indium Corporation’s diversity and strength as a materials supplier to the $2.8 billion sputtering target market, as well as to enhance our position in the metallic thermal interface market, two application segments that are the primary focus of this business. Additionally, we are pleased to bring this technology and business to the city of Utica.”
For more information, visit www.indium.com or www.rntfoil.com.
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