KEMET Corp. recently announced the release of a new high-temperature C0G dielectric platform. These high-temperature, surface-mount C0G MLCCs feature a proprietary base metal dielectric system that reportedly offers industry-leading performance relative to capacitance and case size, combined with capacitance stability at extreme temperatures up to in excess of 200°C. This new platform promotes downsizing opportunities of existing high-temperature C0G technology and offers replacement opportunities for existing X7R/BX/BR technologies.
“Our high-temperature C0G MLCCs offer no capacitance change with respect to applied DC voltage, temperature, and time as demonstrated by class II dielectrics systems, such as X7R dielectric,” said Jeff Franklin, Specialty Product manager for KEMET. “Our customers in the down hole, industrial, military and aerospace markets require the higher capacitance, temperature stability and reliability this new platform offers.”
For more information, visit
www.kemet.com.
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