Articles Tagged with ''glass in electronics''

SPECIAL SECTION/ADVANCED CERAMICS & GLASS: A Better Bond

April 1, 2011
Lead-free glass pastes can offer multiple bonding advantages in MEMS wafer level packaging.
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Success by Design

May 1, 2011
Custom glass formulations can fulfill specific functions in a range of applications.
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Continued Advancement

September 1, 2011
Visit highlights area's high-tech employment opportunities.
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Fitting Square Optics into a Round Hole

December 1, 2011
A new beam-shaping technology sets an example for modern manufacturing.
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Micro-Milling Media

December 1, 2011
A new class of glass-ceramics has been developed for micro-milling media.
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Corning and SCP Renew Agreements

February 10, 2012
Corning Inc., Samsung Corning Precision Materials Co., Ltd. (SCP), and the AMLCD division of Samsung Electronics Co., Ltd. (SEC) recently announced they have renewed the two main agreements for their businesses for five more years.
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Corning and Samsung Form OLED Glass Venture

February 14, 2012
Corning Inc. and Samsung Mobile Display Co. Ltd. recently announced they have signed an agreement to establish a new equity venture for the manufacture of specialty glass substrates for the organic light emitting diode (OLED) device market.
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Studying Glass Compositions

February 22, 2012
A University of North Texas professor is working with Corning to improve glass materials.
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High-Purity Glass Optical Fibers

February 23, 2012
This company has launched PURAVIS™ high-purity glass optical fibers, which can reportedly provide superior properties over existing glass fibers.
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Ferro Joint Venture to Supply Rare Earth-Based Compounds for Glass Polishing

February 23, 2012
Ferro Corp. recently announced it has entered into a joint venture agreement with Baotou Jin Meng Rare Earth Co. Ltd., a refiner of rare earth materials in Baotou, China.
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Multimedia

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Improving HTCCs and LTCCs
Jim Ellis of Credence Engineering discusses the optimization of ceramic substrates for microelectronics applications.
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