MoreLamina Ceramics, Inc. announced recently that it has obtained $12 million in venture capital funding.
Lamina Ceramics, Inc., which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, announced recently that it has obtained $12 million in venture capital funding from Morgenthaler, a national venture capital firm. Sarnoff Corp., the technology development firm that invented the bonding process, is also a major equity partner in Lamina. Taylor Adair, Lamina's CEO, calls the company's technology "a Swiss army knife for solving next generation electrical and mechanical design problems." Bonded ceramic on metal, he says, offers component and packaging customers a multifaceted tool that helps them significantly reduce size, lower system costs, and greatly improve performance.
Lamina Ceramics, Inc., which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, announced recently that it has obtained $12 million in venture capital funding from Morgenthaler, a national venture capital firm. Sarnoff Corp., the technology development firm that invented the bonding process, is also a major equity partner in Lamina. Taylor Adair, Lamina's CEO, calls the company's technology "a Swiss army knife for solving next generation electrical and mechanical design problems." Bonded ceramic on metal, he says, offers component and packaging customers a multifaceted tool that helps them significantly reduce size, lower system costs, and greatly improve performance.
Lamina's website is located at http://www.laminaceramics.com.
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