June 1, 2010
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SEMICON West 2010 takes place July 13-15 at the Moscone Center in San Francisco, Calif. New programs are scheduled to cover leading-edge semiconductor manufacturing, emerging market opportunities in LEDs, flexible electronics, MEMS, and productivity opportunities in established fabs. In addition, the show floor will host hundreds of exhibitors showcasing thousands of new products, technologies, services, and solutions.

Special Events Several keynotes and executive panels are slated for the event. The opening keynote, “From Ghz. to Systems to Solutions: Our Industry in Transition,” will be presented at 9:00 a.m. on July 13 by Bernard S. Meyerson, Ph.D., an IBM fellow and vice president of Innovation and Global University Relations for IBM Systems and Technology Group. At 1:00 p.m., an executive summit moderated by SEMI North America president Jonathan Davis will discuss strategic business and technology issues influencing the supply chain from consumer to manufacturing technology.

At 1:30 p.m. on July 14, Paolo A. Gargini, Ph.D., chairman of the International Technology Roadmap for Semiconductors (ITRS) and director of Technology Strategy at INTEL will give a talk entitled “Welcome to the Next Decade!”

ASMC Co-Located with SEMICON This year, the 21st Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010) will be co-located with SEMICON West for the first time. ASMC provides a venue for industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. The conference synergy leads to understandings and relationships that can benefit participating companies in a variety of ways, including accelerating innovation, promoting successes, and getting a more thorough understanding of standards and benchmarks.

Keynotes at the event will include: “High Density 3D Through Silicon Stacking – Manufacturing Readiness and Challenges,” presented by Matt Nowak, director of Engineering in the VLSI Technology Group, Qualcomm; and “CMOS Transistor Scaling Past 32 nm and Implications on Variation,” given by Kelin Kuhn, Intel fellow and director of Advanced Device Technology at Intel Corp.

Technical sessions will include: Advanced Metrology Advanced Process Control Advanced Processes and Materials Contamination Free Manufacturing Defect Inspection I and II Design for Manufacturing and Lithography Fab Optimization Interactive Poster Session Reducing Cost and Maximizing Equipment Productivity

For more information and a full list of exhibitors, visit

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