Ceramic Industry

AGC Develops Micro-Hole Drilling Processing Technology

March 29, 2012

Asahi Glass Co. Ltd. (AGC) recently announced it has succeeded in developing ultra-high-speed processing technology for micro-hole drilling processing of ultra-thin glass with a thickness of 0.1 millimeter. The combination of this micro-hole drilling processing technology and the production technology for ultra-thin glass reportedly opens the door for glass to be used in leading-edge applications such as laminated semiconductors.

Ultra-thin glass has prospects for being applied to various products due to its thinness (0.1 mm), in addition to the beneficial features such as transparency, heat resistance and electrical insulation. The technology can be applied to hole drilling processing of thin sheet glass for interposers for laminated semiconductors. Laminated semiconductors are produced by vertically stacking semiconductor chips for enhanced performance, and are connected to a printed circuit board by way of an interposer. This interposer needs many holes with a diameter of about 50 μm to connect through-electrodes of semiconductors, etc.

To date, thin sheet glass with a thickness of about 0.3 millimeters has garnered attention as a raw material for interposers, but it has been difficult to drill micro-holes in such thin glass using conventional technologies. By applying the newly developed micro-hole drilling processing technology for ultra-thin glass to process glass interposers, AGC reports it will be able to drill holes precisely and at high speed to connect through-electrodes.

For more information, visit www.agc-group.com/en.