The electrolytic baths comprise aqueous solutions of chromic acid, orthophosphoric acid, sulfuric acid, oxalic acid, or combinations thereof. Because the electrolytic baths have appreciable resistivity, and because the anodization process itself is exothermic, the temperature of the electrolytic bath increases greatly during anodizing. Since the anodizing process is quite sensitive to temperature, the bath temperature is controlled rather closely by heat exchanger or refrigeration equipment. Today's advanced anodizing technologies include several proprietary hard anodizing processes that employ a wide range of electrolyte compositions, operating conditions and a few limited aluminum alloy compositions. The type and thickness of coating obtained greatly depends on the composition of the electrolytic bath, operating conditions and alloy compositions. The military specification MIL-A-8625F, for example, lists at least six types and two classes of electrolytically formed anodic coatings on aluminum and aluminum alloys for non-architectural applications.
Despite the many decades of experience and the expensive equipment employed by the traditional anodizing plants, the acid bath based DC anodizing process has severe limitations. By the very nature of the low voltage DC power employed, the anodic coating is quite porous. Often the volume percent of pores is as much as 50%.
Additionally, because of the low current densities employed, it takes many hours to produce a coating of a few tens of micrometers thick. The electrolytic baths comprise extremely low pH acidic electrolytes, and thus the process does not meet many of today's environmental regulations. The expensive equipment, such as the electric power supplies and heat exchanger, makes the process capital intensive.
The traditional process, for reasons not quite apparent, cannot be used for anodizing aluminum alloys containing high concentrations of Cu and Si. Thus, many aerospace and automotive parts cannot be satisfactorily anodized, if at all. And while the traditional process is appropriate for a limited range of the wrought aluminum alloys, it cannot be used for anodizing other reactive metals, such as Ti, Zr, Mg, etc., intermetallic compounds and metal matrix composites. Thus, most of the promising aluminum-based advanced alloys and composites cannot be protected by the traditional anodizing process.
Above all, the hardness of even the so-called hard anodic coatings is far below the hardness of alpha alumina, the principal component of the anodic coating. Accordingly, the full strength potential of the anodic layer cannot be realized by the traditional process. Indeed, the other potentially beneficial properties of aluminum oxide, such as the high thermal and electrical resistivities and the high dielectric breakdown strength, are not even addressed.
This state of affairs is primarily due to the porosity of the coating produced by the traditional acid-based electrolytic processes at low power levels, and to a certain extent by the poor bonding between the aluminum alloy substrate and the anodic layer.
Much like the traditional process, the microplasmic process is an electrochemical process, but there ends the similarity. The microplasmic process is radically different from the traditional anodizing processes in many respects. First, the process employs alkaline electrolytes whose composition is extremely critical to the coating rate and the properties of the anodic film that is formed. The pH of the electrolyte is in the range of 8-12 and is thus environmentally sound.
The process employs alternating currents at high voltage and high current. Because of the high voltage, a microplasma surrounds the electrodes, and the oxygen ions produced in the plasma diffuse through the anodic film into the aluminum substrate to react and form more anodic film. The high voltage and high current allow the production of anodic films of the same thickness as that of the traditional process in a fraction of the time.
Because the voltages are higher than the breakdown voltage of the film formed, open channels are not necessary for sustaining the process, and hence, dense thick layers of nonporous film can be readily formed. Additionally, because the process employs AC power, the productivity is increased.
The power from an electrical utility supply can be used with proper controls to the electrochemical tank, thus making the process less capital intensive. There is no need for power rectification and waveform smoothing.
The temperature of the electrolytic bath does not need to be precisely maintained. Successful coatings can be obtained even if the temperature excursions are as much as 10-20°C, further simplifying the process.
The electrolytic composition itself is quite variable for different types of coatings; because of the high density of the coating, there is almost no change in the dimension of the anodized part, and a completely finished part can be coated without major post-processing/finishing operations. However, depending on the application, an outer soft coating of about 15% may be buffed off to reveal the remaining inner layer-an extremely hard ceramic layer.
Unlike with the traditional anodization process, aluminum alloy parts of any composition can be successfully anodized by the microplasmic process. Even more importantly, a variety of ceramic "alloy" coatings, such as Al2O3.SiO2, Al2O3.MgO, Al2O3.CaO, etc., can be produced using this process. The process is also suitable for forming a hard coating on the inside surface of a part, such as cylindrical, conical or spherical hollow parts. Many coating processes on the market, including chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced physical vapor deposition (PEPVD), sputtering and thermal spraying, are unable to coat the inside surface of a long part.
Chemical. The ceramic coating can resist both aqueous environments and moderately high temperatures and is resistant to strong acids and bases. Thus it can be used in chemical and food processing industries.
Mechanical. The hardness of the film is over 1300 kg/mm2, permitting the film to be used to resist sliding, abrasive and erosive wear. In addition, the friction coefficient is low and thus can be used in marginally lubricated systems.
Thermal. The thermal conductivity of the anodic film is much less than that of metals. For this reason, anodized parts can be used to maintain uniform distribution of temperature and resist thermal shock.
Electrical and Electronic. The dielectric breakdown strength of the microplasmic film is comparable to that of alpha Al2O3, and hence can be used as an insulating film on electrical and electronic components.
The microplasmic process is also well suited for hard-coating interior surfaces (such as those of hollow cylindrical and conical parts), recesses, blind holes and threaded sections.
Hardness: 1400+ vickers