The chemical mechanical planarization or polishing (CMP) process is vital in semiconductor device production, which uses CMP slurries and pads to planarize the surface of wafers. According to "RGB-288 Chemical Mechanical Polishing Equipment and Materials: A Technical and Market Analysis," a soon-to-be-released report from Business Communications Co., Inc. (BCC), the global market for CMP and post-CMP equipment, CMP slurries, CMP pads, conditioners and other consumables is estimated at $1.7 billion in 2003. This is expected to approach $3.3 billion by 2008, with an average annual growth rate (AAGR) of 14.2% through 2008. The largest share of the market is for CMP and post-CMP equipment, which was $925 million in 2003, constituting 55% of the total CMP market. CMP slurries have a share of 24%, followed by CMP pads with 15% of the market.
For more details or to order the full report, call (203) 853-4266 or visit http://www.bccresearch.com .
