This company planned to introduce two series of metallization paste products enabling next generation high-efficiency cell technologies at PV Taiwan 2011 in October. The materials include two new optimized silver contact pastes to enhance performance of emitter wrap through (EWT) cell architectures and a family of silver pastes to enable cost-effective, high-efficiency cells using n-type silicon wafers.
EWT’s back-contact technology is designed to increase the electrical efficiency of polycrystalline silicon-based solar cells by reducing front contact shadow loss. The company’s new n- and p-contact pastes are reportedly capable of printing high-definition lines to reduce material usage and cost, and are optimized for co-firing. Their high conductivity, low contact resistance and low recombination under contact areas can improve efficiency; in addition, they can provide strong adhesion with EWT cell architectures.
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