The CDP system from Logitech is a versatile polishing machine designed specifically for use in CMP and de-layering polishing applications where geometric precision and surface quality are of paramount importance. Using the CDP system, operators can produce laser quality surfaces (0/0 scratch dig), make improvements to surface topography and achieve Ra to sub-nanometer levels. The CDP system permits nanometer level removal on individual die or on wafers up to a maximum of 8 in. in diameter. The system can also be used for non-traditional applications such as hard substrate polishing, Epi-ready surface preparation and wafer reclamation.
Visit http://www.logitechltd.com for more information.