Morgan Advanced Ceramics (MAC) has introduced precision-manufactured aluminum nitride heat sinks. Proving far more thermally efficient than aluminum oxide components, MAC's aluminum nitride is ideal for passively cooled, high-powered diode modules. With a thermal conductivity of 180 W/m.K, aluminum nitride has over seven times the heat dissipation efficiency of alumina at 25 W/m.K. Aluminum nitride also has about 30% lower coefficient of thermal expansion. Both materials are excellent insulators, with volume resistivities of > 10(14) ohm.cm. If electrical insulation is not important, even higher efficiency heat sinks can be formed from chemical vapor deposition (CVD) silicon carbide.
For more information, call (508) 998-9012, fax (508) 998-1962 or visit http://www.morganadvancedceramics.com.