A new process can be used to machine ceramic parts simply, quickly and at a lower cost than many conventional methods.
A 4-in. silicon wafer with .012-in. diameter thru-holes machined through PMP.
Computer-driven machine tools, like computerized
numerical control (CNC) machining, ultrasonic machining and laser cutting
technologies, have revolutionized the way precision components are machined.
However, these advanced equipment systems often come with high price tags,
time-consuming setup requirements and increased labor costs.
A new alternative has recently been developed. Called the
Photo-Machining Process (PMP),* it provides a lower cost alternative to
conventional machining for many applications. PMP can selectively remove
material or coatings from a variety of dense, hard or brittle materials, and it
can also scribe or mark metal surfaces for labeling identification numbers and
logos with pinpoint accuracy.
In addition, PMP can be used to roughen surfaces to
promote better adhesion between adjoining parts. This process can reduce setup
and machine time, as well as operator skill level. It also benefits ceramic
engineers striving for improvements in design capabilities.
*Developed by IKONICS Corp., Duluth, Minn.
Figure 1. UV light passes through the clear or
transparent areas of the phototool, changing the chemistry of the photoresist
to create a precise and accurately placed pattern that masks the substrate for
subsequent abrasive etching.
PMP combines the precision and accuracy of a photoresist
with abrasive etching to selectively remove materials. Key steps include the
photoresist imaging operation and the abrasive etching process. First, the
design is printed on a transparency-like film with a standard inkjet or laser
printer. This film becomes the working tool, or phototool, for the photoresist
The phototool allows the transfer of the desired pattern
onto the photoresist mask by limiting the ultraviolet (UV) exposure to the
selected pattern (see Figure 1). An abrasive-resistant mask that changes
physical properties when exposed to UV light, the photoresist mask does just
what its name suggests-it resists or repels the abrasive to protect the surface
Figure 2. Very fine particulates are propelled with
compressed air, impacting the substrate not protected by the photoresist. With
precise tuning of the particulate size and air pressure, material is removed
from the substrate in the areas defined by the photoresist pattern.
During the abrasive etching operation, compressed air
propels a fine abrasive, such as silicon carbide, in a closed chamber to
accomplish the actual machining (see Figure 2). The abrasive selectively
removes material in the open or developed areas of the photoresist.
Figure 3. Etch rates for different material surfaces and
relative rate removal differences between materials (not actual time to etch).
The etching system is a dry, low-temperature, low-stress
operation that quickly removes large amounts of material from most hard,
brittle surfaces. The material removal rate depends on the density of the
surface being etched, but examples are shown in Figure 3.
Proprietary photoresist technology is the key to PMP.
Photoresist technology has been around for many years, particularly in the
electronics and decorative etching industries. The films used in PMP have vinyl
or rubber-like properties that repel the impact of abrasives, allowing them to
survive aggressive etching by fine particulates in a precision sandblasting
Figure 4. PMP can be used in a variety of
applications, including (clockwise from top left): a) selective coating
removal, where a conductive material is removed in a precise pattern to reveal
a non-conductive layer below; b) surface texturing to improve mechanical
adhesion to mating layers or parts and/or creating shallow cavities for
lubricants between subsequent layers; c) relief patterns for minimizing contact
in mechanical seal applications, with or without channels to introduce
lubricants; and d) channel patterns used for transferring fluids, air and/or
vacuum in an accurately defined opening.
Brittle materials like ceramics are notoriously difficult
to machine because of their high level of hardness and propensity to chip or
crack. The benefits realized with PMP vary depending on the size and type of
patterns or features that are required. However, detailed patterns and shapes,
such as channels, surface pads, blind holes and/or markings, can be created
with high accuracy and repeatability, with relatively deep etching on lower
density materials (see Figure 4). With film resolution of up to 50 µm (.002
in.), fine detail machining is easy to achieve.
effective for drilling holes in thin wafer materials, and the process enables
hole array patterns to be drilled quickly. All holes are made simultaneously,
which is much faster than the one-at-a-time laser or ultrasonic drilling
methods. Other uses include individually and indelibly engraving hard-to-mark
parts, texturing surfaces for subsequent coatings or to promote adhesive bonds,
and selectively removing coatings from surfaces. Where etch depth control is required,
an automated etching system can be used to maintain 50 µm (.002 in.) depth
variation over a 50 cm (20 in.) length.
Although metals and plastics can be surface engraved or
marked, they cannot be machined deeply with PMP due to their inherently ductile
nature. However, PMP does work well to selectively remove thin layers (<.005
in.) of these materials, such as copper-clad substrates or metal encapsulated
Many of these operations can be accomplished through
traditional machining techniques, but PMP often reduces setup and production
times. In fact, PMP provides several advantages over conventional machining
methods when modifying hard/brittle surfaces or when selectively removing
coatings from these surfaces. PMP enables the removal of large amounts of
material quickly, with little need, if any, for special tooling fixtures or
jigs. The system requires no expensive cutting tools to wear out or replace,
and the reduction in localized heat eliminates the need for coolants. PMP also
has a reduced tendency for "chipped" edges, causes no pitting or
stray markings, and does not require a subsequent deburring step.
Due to the buildup of abrasive in the etched cavity, PMP
produces a tapered side wall as the etch deepens. This buildup causes the sides
of the feature to etch more slowly than the center, leaving the bottom of the
etch area with a slight radius.
PMP combines proprietary photoresists with fine
particulate abrasive etching to create a variety of precisely machined parts.
The process is simple, quick and less expensive than many conventional
machining methods. While PMP does not entirely displace the need for
conventional machining, it opens up opportunities as an excellent alternative
in a wide range of applications.
For additional information regarding PMP,
contact IKONICS Corp. at 4832 Grand Ave., Duluth, MN 55807; (800) 643-1037; fax
(218) 628-2064; or visit www.ikonicsindustrial.com.
SIDEBAR: PMP Possibilities
Below is a partial list of materials and coatings that
have been tested with PMP:
- Alumina Silicate
- Aluminum Nitride
- Anodized Aluminum
- Boron Carbide
- Carbon Fiber
- Ceramic Composites
- Plated/Painted Materials
- Silicon Carbide
- Silicon Nitride
- Titanium Nitride