Rohm and Haas Electronic Materials CMP Technologies has introduced a new series of non-acidic barrier slurries optimized for chemical mechanical planarization (CMP) of 90 nm low-k semiconductor devices. The LK Series barrier slurries accommodate a wide range of integration schemes and offer superior defectivity performance and flexibility. These slurries are currently being qualified and tested at multiple customer facilities, including logic device manufacturers. Comprised of LK301 and LK309 barrier slurries, the LK Series is the next generation beyond the company's CUS1351 slurry, which is currently used in high-volume semiconductor production.

Additional information is available at http://electronicmaterials.rohmhaas.com