Starfire Systems Inc. has been awarded a $1.8 million National Institute of Standards and Technology (NIST) Advanced Technology Program (ATP) Grant to develop "Ceramic Matrix Composite Boards for SOP (System-On-a-Package) and SIP (System-In-a-Package) Electronic Packaging." The total program is expected to cost approximately $4 million over three years. Under the program, Starfire will develop a silicon carbide-based ceramic matrix composite circuit board having the performance properties of monolithic ceramics and the processing advantages of polymer derived composites, which are expected to meet the increasingly demanding requirements of mirominiaturized electronic systems for the next decade.

For more information, call (518) 899-9336, fax (518) 899-7198, e-mail atmurs@starfiresystems.com or visit http://www.starfiresystems.com .