A non-destructive method has been used to visualize the paths of a chip's internal wiring and transistors.
June 1, 2017
Researchers at the Paul Scherrer Institute (PSI) have made detailed 3-D images of a commercially available computer chip. This reportedly marks the first time a non-destructive method has visualized—clearly, without distortions or deformations—the paths of a chip’s internal wiring (just 45 nm wide) and its 34-nm-high transistors.
After instructing an U.S. Occupational Safety and Health Administration (OSHA) 10-hr Industrial Safety course at the 2016 Ceramics Expo in Cleveland, Ohio, I was invited by Edgar Lara-Curzio of Oak Ridge National Laboratory to participate in the “Best Practices in Academic Laboratory Safety” symposium at the 2017 Material Science & Technology (MS&T) meeting in Pittsburgh, Pa.
Micro- and nanoscale structures within a material’s surface are invisible to the naked eye, but play a big role in determining a material’s physical, chemical, and biomedical properties. Over the past few years, Chunlei Guo and his research team at the University of Rochester have found ways to manipulate those structures by irradiating laser pulses to a material’s surface.