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Valley Design Corp.: Dicing Services

December 4, 2000
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This company offers precision dicing services for R&D efforts as well as high volume contract dicing requirements. Dicing saws can handle materials up to 6 in. in diameter, are fully programmable and are equipped with microscope and video for precision alignment. Accurate dicing is offered for materials such as silicon wafers, glass, sapphire, quartz disks, silicon carbide, ferrites and ceramics, as well as delicate compound semiconductors like GaN and InP.

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