MURATA AMERICAS: High-Frequency Matching Device for IoT Applications
Murata Americas recently announced the availability of its LFD21891MMF3D931 high-frequency matching device for use in sub-GHz 802.15.4 wireless Internet of Things (IoT) applications. Designed in collaboration with Silicon Labs and optimized for use with its Si4461 868 MHz wireless transceiver IC, this solution reportedly incorporates all the necessary components in an ultra-compact package. Encapsulated in a low-profile device measuring 2.0 x 1.25 x 0.7 mm, the footprint is approximately 75% smaller than traditional discrete components.
As the demand for IoT functionality increases, so too does the need for engineers to be able to quickly integrate wireless connectivity into applications. This typically requires a high level of wireless circuitry design expertise. The transceiver coupled with this LFD21891MMF3D931 optimized matching device reportedly helps reduce the product design cycle, as well as the amount of required engineering resources.
“Murata is continually innovating to meet the varied and complex needs of IoT customers,” said Scott Klettke, general manager. “Taking this into account, we offer a range of solutions, from the basic component building blocks to fully integrated hardware and software modules. The LFD21891MMF3D931 sits at the center of this range to deliver IoT functionality in a turnkey solution.”
More information can be found at www.murata.com.