Kyocera to Break Ground on Third Kyoto Ayabe Facility
Kyocera Corp. recently announced that it will begin construction on a third manufacturing facility.
Kyocera Corp. recently announced that it will begin construction on a third manufacturing facility at its Kyoto Ayabe complex in Ayabe City, Kyoto Prefecture, Japan. The facility will produce miniaturized, low-profile organic packages to house microelectronic devices used inside smartphones, tablet PCs and related mobile communications equipment. Kyocera’s microelectronic packaging technology can reportedly facilitate higher functionality, greater integration, and slimmer designs in mobile communications equipment.
Kyocera expects the market for its package products to grow as consumer devices incorporate multiple internal modules for camera, wireless, power amplifier, and control functions. In addition, the expanding Internet of Things (IoT) trend is expected to generate new applications for Kyocera products, as wireless chips and sensor chips are increasingly modularized into packaging solutions based on organic material technology.
Until April 1, 2016, the Kyoto Ayabe complex was operated by the former Kyocera Circuit Solutions, Inc. (KCS), a subsidiary specializing in high-density organic wiring boards, packages and large-scale printed motherboards for semiconductor devices. In April, KCS was merged into Kyocera Corp. as part of a business integration strategy to enhance the development of new products and markets while further expanding business synergies. The third facility is planned to be completed in December 2016 and operational in April 2017. The factory building will be designed with environmental consideration such as reuse of water emissions.
For more information, visit http://global.kyocera.com.