SCHOTT Showcases Glass Wafer Portfolio at ECTC
SCHOTT presented its thin and ultra-thin glass wafers, as well as sheets for semiconductors and optoelectronics, at the recent Electronic Components and Technology Conference.
SCHOTT presented its thin and ultra-thin glass wafers, as well as sheets for semiconductors and optoelectronics, at the recent Electronic Components and Technology Conference (ECTC) in Las Vegas, Nev. SCHOTT’s broad portfolio of glass wafers and substrates reportedly is known for its chemical and thermomechanical properties and surface qualities. The wafers and substrates are available in different sizes (wafer diameters up to 12 in.; sheet sizes up to 510 x 510 mm2) and thicknesses (from 1.1 mm down to ultra-thin 25 µm). Additionally, SCHOTT offers extensive application support in the field of handling technologies and formation of glass wafers with through glass vias (TGV), which cover a wide spectrum of feature sizes.
“With these technologies, SCHOTT can support the emerging ‘More-than-Moore’ trends throughout the electronics industry,” said Rüdiger Sprengard, Ph.D., director New Business Ultra-Thin Glass. “Ultra-thin glass wafers and substrates are enabling consumer electronics to be even thinner, and help make possible the high-performance computing necessary for applications like self-driving cars. Because of the versatility and unique properties of these materials, the engineering and design possibilities stretch far beyond the traditional electronics and into new industries.”
SCHOTT recently expanded its wafer portfolio with FOTURAN® II, a photo-structurable glass that is reportedly significantly more advanced in quality, such as material homogeneity, than its 30-year-old predecessor. The material’s properties reportedly enable high aspect ratio and small feature sizes in RF components and MEMS systems. FOTURAN II wafers can be structured and processed in three steps: UV-exposure (with standard lithography equipment, but without the use of photo-resist), tempering, and etching. Additional ceramization is an option when higher temperature stability is required.
“Superior materials, like ultra-thin glass wafers, give engineers the ability to pack more power into smaller forms,” said Sprengard. “The next innovations in semiconductor and optoelectronics technologies, such as MEMS and driverless car components, are made possible with specialty glass. These materials are helping create new innovations and opportunities across many industries because of their chemical properties and strength.”
For more information, visit www.us.schott.com.