SCHOTT: Structured Glass Wafers
The smallest structuring radius is set to 150 μm, and the feature size tolerance is lower than ± 25 μm.
SCHOTT recently announced that it has developed a process that enables freedom of design and high precision in structured glass wafers. “Component manufacturers have been on the hunt for more precise, lighter, and thinner structured glass wafers, but mechanical structuring methods have reached their limits,” said Matthias Jotz, product manager at SCHOTT Advanced Optics. “New applications that have been waiting for smaller components are finally possible.”
An increasing trend toward miniaturization in integrated circuit (IC) packaging, biochips, sensors, micro-batteries, and diagnostic technology has pushed demand for high-precision structured glass wafers, even as the technology to create them has reached its limits. According to SCHOTT, its new FLEXINITY structuring portfolio offers complete freedom of design on glass wafers and thin glass. With FLEXINITY, any shape is reportedly possible, and the process allows extremely tight tolerances and structures. Structured wafers are available made of glass types from SCHOTT’s down-draw glass portfolio or plano-plano-processed BOROFLOAT 33® borosilicate glass.
SCHOTT’s structured glass wafers are available in 4-12-in. wafers, in thinnesses ranging from 0.1-3.0 mm. The smallest structuring radius is set to 150 μm, and the feature size tolerance is lower than ± 25 μm. Customers can choose from several different glass types, such as borosilicate glass (MEMpax®, D 263® family, BOROFLOAT 33®) and alkali-free glass (AF 32® eco).
For more information, visit www.schott.com.