Corning Pursues Semiconductor Glass Carrier Opportunities in Asia
Corning’s semiconductor glass carriers are used for temporary bonding in advanced semiconductor packaging applications such as silicon thinning and fan-out packaging.
Corning Inc. and SCH Electronics (Shanghai) Co. recently announced that they have signed a sales agency agreement focused on China. This agreement will reportedly connect potential customers in China to Corning’s glass carrier products and help expand Corning’s presence in this fast-growing market.
Corning’s semiconductor glass carriers are used for temporary bonding in advanced semiconductor packaging applications such as silicon thinning and fan-out packaging. These processes are key to producing smaller, faster computer chips for consumer electronics, automobiles, and other connected devices.
SCH Electronics delivers semiconductor components and provides technical expertise to support the supply of materials, instruments, and engineering for sophisticated tech fabs. SCH Electronics has business operations in Taiwan, China, and Singapore, and has established a network of customers throughout the Asia-Pacific region.
“We’re excited to work with SCH to better support customers in China as they join the industry trend of increased glass adoption,” said Dave Velasquez, division vice president and general manager of Corning Precision Glass Solutions. “Corning has delivered glass-based solutions in high volumes to top-tier semiconductor customers globally for years, and SCH is well-established in China’s electronics supply chain. Together, we expect to greatly expand the reach of our high-quality glass products at cutting-edge semiconductor companies.”
For more information, visit www.corning.com/precision-glass-solutions.