CORNING PRECISION GLASS SOLUTIONS: Glass Carrier Wafers
According to Corning, its Advanced Packaging Carriers feature three significant improvements: fine granularity in a wide range of available coefficients of thermal expansion (CTE), high stiffness composition, and rapid sampling availability.
Corning Inc. recently introduced Advanced Packaging Carriers, an enhanced line of glass carrier wafers optimized for fan-out processes, a type of semiconductor packaging that reportedly enables smaller, faster chips for consumer electronics, automobiles, and other connected devices. According to Corning, its Advanced Packaging Carriers feature three significant improvements: fine granularity in a wide range of available coefficients of thermal expansion (CTE), high stiffness composition, and rapid sampling availability. These attributes are reportedly important for customers pursuing fan-out packaging because:
- Fine granularity enables customers to more easily select the optimal CTE needed to minimize in-process warp. Precise CTE offerings thereby help reduce customers’ development cycle time.
- Corning’s high stiffness compositions help further reduce in-process warp. Minimizing warp helps maximize their yield of packaged chips.
- Rapid sampling availability also contributes to reduced development time and enables customers to move to the mass production phase more quickly.
“We created Corning Advanced Packaging Carriers especially for our customers pursuing the most challenging types of chip manufacturing processes,” said Rustom Desai, commercial director of Corning Precision Glass Solutions. “Our deep technical ties in the semiconductor industry, combined with Corning’s core competencies in glass science and manufacturing, enabled us to create an innovative product that can help customers maximize efficiency throughout their development process and mass production ramp.”
Additional details are available at www.corning.com.