IPC_® recently released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. The updated revision will be released in conjunction with IPC-6012DS,Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.

This D revision caps off a multi-year effort to update the core specifications in the IPC-6010 performance series, including IPC-6013C for flexible printed boards and IPC-6018B for high-frequency (microwave) printed boards, with updated acceptance criteria for HDI/microvia structures. Moving forward, IPC will be able to retire the outdated IPC-6016 specification for HDI/microvia structures that was published in 1999.

“The IPC-6012D revision represents a significant body of work by the IPC D-33a Rigid Printed Board Performance Task Group,” said John Perry, director of printed board standards and technologies. “A revision effort spanning five years, there are hardly any pages in the new revision where some level of content change or addition did not take place.”

Some of the additions to this revision reportedly include updated requirements for dielectric removal, HASL solder pots, printed board edges, and markings and solder mask coverage. The report also includes new microvia requirements for both the capture and target lands. Some of the revisions that address microvia structures include annular ring, plating to land separation, target land penetration, and voiding in plated and copper filled structures.

 For more information, visit www.IPC.org.