Kyocera Corp. recently announced that it has developed a new series of hybrid cermet materials that reportedly offer a 50% improvement in abrasion resistance and fracture resistance over conventional materials used as industrial cutting tool inserts.
The objective of the High-Temperature Electronics Network (HiTEN) conference is to have a forum that brings together researchers and practitioners in academia and industry from all over the world Read More
SEMICON West, July 14-16, 2015 Moscone Center, San Francisco, is the premier event for people, products, and companies driving the future of microelectronics design and manufacturing and is the global marketplace for microelectronics innovation.
The Microscopy & Microanalysis program will highlight the latest techniques, methodologies and findings, spanning nano-to-macroscopic scales, and advances in fields such as nanotechnology, biological and clinical sciences, materials science, 3D manufacturing, and metallurgy.
The purpose of this workshop organized each year by IMAPS is to promote presentation and discussion of leading-edge developments in thermal management components, materials, and systems solutions for removing, spreading, and dissipating heat from microelectronic devices and systems.
The International Conference on High-Performance Ceramics (CICC) series is sponsored by the Chinese Ceramic Society and aims at providing an international forum for presentation, discussion and review of the latest advance in science and technology of high-performance ceramics.
ASME’s International Mechanical Engineering Congress and Exposition (IMECE) is reportedly the largest interdisciplinary mechanical engineering meeting in the world. IMECE plays a significant role in stimulating innovation from basic discovery to translational application.