Ceramics Process Systems Corp. recently announced a strategic partnership with sp3 Diamond Technologies, Inc. Geared toward meeting the growing market need for electronics packages with enhanced thermal dissipation requirements, the two companies are partnering to provide AlSiC packages incorporating diamond pins. The new packages provide manufacturers of electronic devices, such as graphics processors, transportation power modules and military communication components, with dramatic device power and reliability improvements through extremely high thermal conductivity paths (1200 W/m-K) and a tailored, low coefficient of thermal expansion.

"We are excited to enter into this partnership with CPS, as our unique thermal management technologies are a perfect complement to each other," said Dwain Aidala, president of sp3. "We have immediately added the industry-proven CPS AlSiC packages with diamond pins to our product portfolio, and look forward to the increased market penetration that this partnership will provide."

For additional information, visit www.sp3inc.com or www.alsic.com.

Links

• AlSiC
• sp3 Diamond Technologies, Inc.