Tom Adams

Tom Adams is a consultant for Sonoscan, Inc., Elk Grove Village, Ill.

ARTICLES

Acoustically Measuring Polycrystalline Diamond Thickness

Wafer manufacturers can use acoustic imaging to measure the thickness of PCD inserts without sectioning the wafers.

Various types of polycrystalline diamond (PCD) cutting tool inserts are made from a wafer in which tungsten carbide (WC) serves as a substrate. The PCD provides the hardness and durability that makes cutting possible, while the WC provides a strong base.


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High Acoustic Frequency Imaging

Tiny ceramic chip capacitors can be screened for defects using high acoustic frequency imaging.

An internal structural defect in a ceramic chip capacitor becomes activated when it expands to create an electrical leakage path between two adjacent electrode layers.


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Identifying Defects

A new imaging process can identify extremely small surface or sub-surface cracks in silicon nitride bearing balls.


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SPECIAL SECTION/ADVANCED CERAMICS: Looking Acoustically at MLCCs

Acoustic micro-imaging systems help manufacturers find defects in multi-layer ceramic chip capacitors.
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