A non-destructive method has been used to visualize the paths of a chip's internal wiring and transistors.
June 1, 2017
Researchers at the Paul Scherrer Institute (PSI) have made detailed 3-D images of a commercially available computer chip. This reportedly marks the first time a non-destructive method has visualized—clearly, without distortions or deformations—the paths of a chip’s internal wiring (just 45 nm wide) and its 34-nm-high transistors.
Our annual R&D Directory is a buyers’ resource that provides supplier* details for equipment, instruments, and services targeted for research and development applications. Use this guide as a handy way to find suppliers throughout the year
Research and development (R&D) is a key driver for growth in the ceramic, glass, refractories, brick and related industries. Any company that does not innovate is almost sure to stagnate and eventually lose ground to more forward-thinking competitors. This issue includes our annual R&D Directory to help manufacturers find the best supplier partners for their specific research and development efforts.
Measuring the elastic properties of a green ceramic as it is being fired can be difficult and often requires sophisticated non-destructive testing (NDT) techniques. One effective method is called the the impulse excitation technique (IET).
Acoustic micro-imaging tools perform the non-destructive imaging and analysis of internal features (including anomalies and defects) in advanced ceramics and other materials by pulsing ultrasound into the sample and receiving the return echoes.