IPC-Association Connecting Electronics Industries® is reaching out to the European electronics industry and IPC members to join the IPC European Standards Steering Committee.

The thermal coatings segment is anticipated to be the largest application area for hexagonal boron nitride from 2017-2021.

Skyworks Solutions, Inc. recently reported third fiscal quarter results for the period ending June 30, 2017.

A U.S. company reportedly expects 50 of its employees to volunteer to have radio frequency ID (RFID) chips implanted.

GT Advanced Technologies recently announced that it has launched a silicon carbide production solution with a stable and repeatable process, reportedly capable of producing high-quality, semiconductor-grade, 6-in. silicon carbide boules.

A patent application published last week indicates that the finish of the next iPhone could be reflective.

In a recent technology survey, 10% of respondents indicated that they expect mass-market OEMs to have the most to gain from the mobility as a service (MaaS) megatrend.

The piezoelectric sensors and ultrasonic transducers market has experienced robust growth in the last two decades, and will continue to witness strong growth in the coming years.

PCB sales and orders were both down in May 2017 compared to last year, according to IPC-Association Connecting Electronics Industries.

Dedicated augmented reality (AR) and virtual reality (VR) headsets collectively are expected to grow at a strong pace from just under 10 million units in 2016 to just shy of 100 million units in 2021, with a five-year compound annual growth rate (CAGR) of 57.7%.